株式会社中興商事
CHUKO SHOJI CO., LTD.
CHUKO SHOJI CO., LTD.
LIMUPIA PFPE H is a line of dielectric fluids with boiling points ranging from135°C ～270°C.
Their excellent dielectric properties, high chemical stability combined with their capacity to operate at very low as well as elevated temperatures make them the best Heat Transfer Fluids for the agressive conditions used in Semiconductor and Electronic Industry
LIMUPIA PFPE H Series （H135,H170,H200,H230,H270）
Galden HT135~HT270 Replacement
FEATURES ＆BENEFITS
| FEATURES | BENEFITS |
| High boiling point with low pour point and low viscosity | Wide choice of grades to optimize performance |
| Low evaporation | Use of high boiling grades to reduce evaporation losses without affecting performance |
| Excellent electrical resistivity (a billion times higher than DI-water) |
Low environmental load Low cost of ownership |
| No significant change in resistivity with use |
No resistivity monitoring necessary No risk of short circuiting even if leak occurs on to electronic components |
| High transparency to Rf and Microwaves Power |
High MTBF (Mean Time Between Failure) Better process control |
|
Excellent thermal and chemical stability
Good compatibility with materials |
No corrosion or reaction with construction materials No formation of decomposition residues No circulating pump seizure due to fluid degradation or corrosion |
|
No flash or fire points
No Auto Ignition Point
No Explosion hazards
|
Enhanced safety
Safe to use at high temperature |
Application Chart
| Industry | Applications | Key Features |
|
Semiconductors Front - End |
Heat Transfer media for: Steppers, Dry - Etchers, CVD, PVD and Ion Implanters |
Excellent Dielectric Properties, Thermal Stability, Safety and Low Cost of Ownership |
|
Semiconductors Back - End |
Heat Transfer media for: Probers |
Excellent Dielectric Properties, Excellent Heat Transfer Efficiency, Safety |
| Electronic |
Heat Transfer media for: Testing Equipments |
Excellent Dielectric Properties, Safety, Environmental Safety |
Product Specifications Table
| Characteristic | unit | H135 | Ｈ170 | Ｈ200 | Ｈ230 | Ｈ270 |
| Boiling point | ˚C | 135 | 170 | 200 | 230 |
270 |
| Pour Point | ˚C | –100 | –97 | –85 | –77 | –66 |
| Density | g/cm3 | 1.72 | 1.77 | 1.79 | 1.82 | 1.85 |
| Kinematic Viscosity | cSt | 1.00 |
1.80 |
2.40 | 4.40 | 14.00 |
| Vapor pressure | torr | 5.8 |
0.8 |
0.2 | 0.03 | < 10–2 |
| Specific heat | cal/g·˚C | 0.23 | 0.23 | 0.23 | 0.23 | 0.23 |
|
Latent heat of vaporization at the boiling point |
cal/g | 16 |
16 |
15 | 15 | 15 |
| Refractive index | - | 1.280 | 1.280 | 1.281 | 1.283 | 1.283 |
|
Thermal expansion coefficient |
cm3 /cm3 ·˚C | 0.0011 | 0.0011 | 0.0011 | 0.0011 | 0.0011 |
| surface tension | dyne/cm | 17 | 18 | 19 | 19 | 20 |
| Thermal conductivity | W/m·K | 0.065 | 0.065 | 0.065 | 0.065 | 0.065 |
| Dielectric Strength |
kV （2.54mm gap） |
40 | 40 | 40 | 40 | 40 |
| Dielectric constant | - | 1.92 | 1.94 | 1.94 | 1.94 | 1.94 |
| Volume resistivity | Ωcm | 1.5 x 1015 | 1.5 x 1015 | 6 x 1015 | 6 x 1015 | 6 x 1015 |
| Average molecular weight | amu | 610 | 760 | 870 | 1020 | 1550 |
| Dielectric tangent（1 Khz） | - | 2 x 10– 4 | 2 x 10– 4 | 2 x 10– 4 | 2 x 10– 4 | 2 x 10– 4 |
All values at 25 ˚C unless otherwise stated
Packing
5kg, 20kg